The technology discloses a button polishing method, in which a high-frequency ceramic particle, a button to be polished, a silica sand powder, and a chemical polishing agent are placed in a double-edged vortex polisher, and the material is immersed in water to maintain the quality of the polished button and the high-frequency ceramic particle. The ratio of 1:2 to 1:7, silica sand powder and chemical polishing agent are respectively 2%-7%, 0.5%-1.5% of the total mass of solid materials, and the size of the high frequency porcelain particles is 2.5×8.0 mm. Or 3 × 3mm, set the first polishing time, vortex polishing machine speed is 100-180 rev / min, according to the first polishing effect, set the second polishing time, to meet the requirements of the button gloss, clean the button. The polishing method of the button described in the technology improves the polishing efficiency by 3:4 times compared with the traditional method, the polishing effect is more stable, the production period is shortened, the labor cost and the labor intensity of the staff are reduced, and the obtained button has an excellent appearance.
1. Put high-frequency ceramic particles, buttons to be polished, silicon sand powder, and chemical polishing agent in a double-edged vortex polisher, and immerse the above materials in water; the mass ratio of the button to be polished and the high-frequency ceramic particles is 1:2- 1:7, the amount of silica sand powder is 1%-5% of the total mass of solid materials, the amount of chemical polishing agent is 0.5%-1.5% of the total mass of solid materials, and the size of the high-frequency ceramic particles is 2.5* 8.0mm or 3*3mm;
2, set the first polishing time, double eddy current polishing machine speed is 100-180 rev / min;
3, according to the first polishing effect, set the second polishing time, to meet the requirements of the button gloss;
4, cleaning buttons.
The chemical polishing agent is a mixture of one or more of a wax emulsion, an organosilicon compound, sodium stearate, sodium dodecylbenzenesulfonate or a silicone-modified polyether surfactant.
The chemical polishing agent is composed mainly of the following weight percentages of raw materials: 75-84 wt% of a wax emulsion, 4-6 wt% of an organosilicon compound, and 12-19 wt% of sodium stearate.
1, the silicon sand powder has a particle size of 150-400 mesh.
2, the first polishing time is 2-6h,
3. The second polishing time is 0.5-1.5 h.
1. Put high-frequency ceramic particles, buttons to be polished, silicon sand powder, and chemical polishing agent in the double eddy current polishing machine, add water to immerse the above materials; the mass ratio of the button to be polished and the high-frequency ceramic particles is 1:5- 1:7, the size of high-frequency ceramic particles is 2.5*8.0mm, the amount of silica sand powder is 3%-5% of the total mass of solid materials, the particle size is 300-400 mesh, the amount of chemical polishing agent is solid material 1%-1.5% of the total mass, the chemical polishing agent is an aqueous emulsion of palm wax or high density oxidized polyethylene wax, an organic silicon compound, sodium stearate, sodium dodecylbenzene sulfonate, and silicone modified One or a mixture of two or more kinds of polyether surfactants;
2, set the first polishing time 5-6h, double eddy current polishing machine speed is 100-180 rev / min;
3, set the second polishing time 0.5-1.5h;
4, cleaning buttons, have a gloss greater than 80 degrees full light button.
The chemical polishing agent is mainly composed of the following weight percentage raw materials: 75-84 wt% of carnauba wax emulsion, 4-6 wt% of organic silicon compound and 12-19 wt% of sodium stearate.
1. Put high-frequency ceramic particles, buttons to be polished, silicon sand powder, and chemical polishing agent in a double eddy current polishing machine, and immerse the above materials in water; the mass ratio of the buttons to be polished and the high-frequency ceramic particles is 1:3- 1:5, the size of high-frequency ceramic particles is 3*3mm, the addition amount of silica sand powder is 2%-3% of the total mass of solid materials, the particle size is 150-300 mesh, and the addition amount of chemical polishing agent is total solid material. 0.5%-1% of the mass, the chemical polishing agent is an aqueous emulsion of a paraffin wax or a low density oxidized polyethylene wax, an organic silicon compound, sodium stearate, sodium dodecyl benzene sulfonate, and a silicone-modified polyether. One or a mixture of two or more surfactants;
2, set the first polishing time 4-5h, double eddy current polishing machine speed is 100-180 rev / min
3, set the second polishing time 0.5-1h;
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